BERGQUIST® GAP PAD® TGP 1500
Conocido como Gap Pad® 1500
Características y Ventajas
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD® TGP 1500 is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Información técnica
| Color | Negro |
| Conductividad térmica | 1.5 W/mK |
| Espesor | 0.508 - 5.08 mm |
| Módulo de Young, ASTM D575 | 310.0 KPa (45.0 psi ) |
| Temperatura de funcionamiento | -60.0 - 200.0 °C |
BERGQUIST® GAP PAD® TGP 1500
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.