BERGQUIST® GAP PAD® TGP 1500
Connu sous le nom de Gap Pad® 1500
Caractéristiques et avantages
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD® TGP 1500 is a silicone-based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Informations techniques
| Conductivité thermique | 1.5 W/mK |
| Couleur | Noir |
| Module de Young, ASTM D575 | 310.0 KPa (45.0 psi ) |
| Température de service | -60.0 - 200.0 °C |
| Épaisseur standard | 0.508 - 5.08 mm |
BERGQUIST® GAP PAD® TGP 1500
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.5W/mK.